New issue: Issuer Chengdu Hi-tech Investment Group issued bonds () with the coupon rate of 3.17% in the amount of CNY 2500 mln maturing in 2032
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Statusoutstanding
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Country of riskChina
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Redemption (put/call option)
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Amount2,500,000,000 CNY
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М/S&P/F
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Full nameChengdu Hi-tech Investment Group Co Ltd
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Registration countryChina
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IndustryDomestic and Commercial Construction
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М/S&P/F
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