Chengdu Hi-tech Investment Group Bonds, 3.17% 9aug2032, CNY (FIGI BBG0191ZQ0T0, 2280354, CND10005JYW3)

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Domestic bonds

Issue | Issuer

Issuer

M

*** | ***

***
S&P

*** | ***

***
F

*** | ***

***

Status

Outstanding

Amount

2,500,000,000 CNY

Placement

***

Redemption (put/call option)

*** (-)

ACI

Country of risk

China

Current coupon

***%

Price

Yield / Duration

Placement amount

2,500,000,000 CNY
Outstanding amount

2,500,000,000 CNY
USD equivalent

371,903,438.99 USD
Face value

100 CNY
ISIN

CND10005JYW3
CFI

DBFXFR
FIGI

BBG0191ZQ0T0
Ticker

CDHIIN V3.17 08/09/32 INBK

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Issue information

Profile

Chengdu Hi-tech Investment Group Co., Ltd. develops and operates industrial parks. The company engages in development and operation of High-tech Zone South Park and West Park; project financing and management through the capital operation and financial instruments; operation and management of state-owned assets; and enterprise and technology development of Chengdu Hi-tech Zone.

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Issuer

Go to the issuer page
Chengdu Hi-tech Investment Group
Full borrower / issuer name

Chengdu Hi-tech Investment Group
Sector

Corporate
Industry

Domestic and Commercial Construction

Volume

Placement amount

2,500,000,000 CNY
Outstanding amount

2,500,000,000 CNY
Outstanding face value amount

2,500,000,000 CNY
USD equivalent

371,903,439 USD

Face value

Face value

100 CNY
Outstanding face value

*** CNY
Increment

*** CNY

Listing

Listing

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Cash flow parameters

Reference rate

***

Coupon Rate

***

Day count convention

***

Interest Accrual Date

***

Coupon frequency

*** time(s) per year
Payment currency

***
Maturity date

***

Cash flow

Export to Excel

Early redemption terms

***

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1 000 000

bonds

100 000

stocks

175 910

ETF & Funds

100 000

indices

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Bond Search
Watchlist
Excel ADD-IN

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— Are you looking for the complete & verified bond data?

— We have everything you need:

Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds

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Enhance your portfolio management with Cbonds Excel Add-in

Build yield maps, make chart comparison within a click

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Placement

Placement method

Open subscription
Placement type

Public
Order book

*** - ***
Placement

*** - ***
Initial issue price (yield)

(***%)
Geographic breakdown

***
Investor breakdown

***

Conversion and exchange

Conversion terms

***

Latest issues

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Similar issues

News

28/04/2026	Upcoming Issue: Chengdu Hi-tech Investment Group 1Y
28/04/2026	Upcoming Issue: Chengdu Hi-tech Investment Group 5Y
23/07/2025	Upcoming Issue: Chengdu Hi-tech Investment Group
16/08/2022	New issue: Issuer Chengdu Hi-tech Investment Group issued bonds () with the coupon rate of 3.17% in the amount of CNY 2500 mln maturing in 2032
20/10/2021	New bond issue: Chengdu Hi-tech Investment Group issued international bonds (XS2377688093) with a 2.7% coupon maturing in 2026

All organization news

IFRS/US GAAP reports

2022



	IV q eng
2021

	II q eng

	IV q eng

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Identifiers

State registration number

2280354
ISIN

CND10005JYW3
Cbonds ID

1322115
CFI

DBFXFR
FIGI

BBG0191ZQ0T0
Ticker

CDHIIN V3.17 08/09/32 INBK
Type of security by CBR

***

Ratings

Bond classification

Rank: Undefined
Registered
Coupon bonds
Amortization
Callable
CDO
Convertible
Dual currency bonds
Variable rate
For qualified investors (CIS region)
Foreign bonds
Green bonds
Guaranteed
Inflation-linked principal
Supranational bond issues
Inflation-linked coupon
Mortgage bonds
Non-complex financial instruments (MiFID)
Perpetual
Payment-in-kind
Non-Marketable Securities
Redemption Linked
Restructuring
Retail bonds
Covered
Securitization
Structured product
Commercial Bonds
Subordinated
Sukuk
Trace-eligible

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Restructuring

***