Bond Screener
Chengdu Hi-tech Investment Group
LEI 3003007DVF9FE4D0JJ37
Organization name
Chengdu Hi-tech Investment Group Co Ltd
Country name
China
Country of registration
China
Industry
Domestic and Commercial Construction
Credit Ratings
in foreign currency
Public debt
4,779 mln USD
New to Cbonds? · Take a 90-second tour of the platform.
Discover what you can do with Cbonds
Everything you need for fixed income research and monitoring.
- 00:23 Coverage
- 00:40 Bond screener
- 00:54 Parameters
- 01:10 Watchlist, Mobile app
- 01:15 Excel Add-in
Trading Schedule Issuer map
Quotes
/
/
/
pcs.
pcs.
pcs.
- «
- 1
- ...
- {{ quotes.page - 2 }}
- {{ quotes.page - 1 }}
- {{ quotes.page }}
- {{ quotes.page + 1 }}
- {{ quotes.page + 2 }}
- ...
- {{ quotesLastPage }}
- »
Quotes provided by information providers are indicative in nature
Profile
|
Chengdu Hi-tech Investment Group Co., Ltd. develops and operates industrial parks. The company engages in development and operation of High-tech Zone South Park and West Park; project financing and management through the capital operation and financial instruments; operation and management of state-owned assets; and enterprise and technology development of Chengdu Hi-tech Zone.
|
General information
-
Organization nameChengdu Hi-tech Investment Group Co Ltd
-
Organization statusOperating organization
-
Site
News
-
Upcoming Issue: Chengdu Hi-tech Investment Group 1Y28/04/2026
-
Upcoming Issue: Chengdu Hi-tech Investment Group 5Y28/04/2026
-
Upcoming Issue: Chengdu Hi-tech Investment Group23/07/2025
-
New issue: Issuer Chengdu Hi-tech Investment Group issued bonds () with the coupon rate of 3.17% in the amount of CNY 2500 mln maturing in 203216/08/2022
-
New bond issue: Chengdu Hi-tech Investment Group issued international bonds (XS2377688093) with a 2.7% coupon maturing in 202620/10/2021
