New bond issue: Chengdu Hi-tech Investment Group issued international bonds (XS2377688093) with a 2.7% coupon maturing in 2026
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Statusoutstanding
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Country of riskChina
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Redemption (put/call option)
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Amount300,000,000 USD
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М/S&P/F
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Full nameChengdu Hi-tech Investment Group Co Ltd
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Registration countryChina
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IndustryDomestic and Commercial Construction
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М/S&P/F
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