Chengdu Hi-tech Investment Group, 2.7% 28oct2026, USD (FIGI RegS BBG0132X5MX7, XS2377688093, WKN A3K8BW)

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International bonds, Trace-eligible, Senior Unsecured

Issue | Borrower

Borrower

M

*** | ***

***
S&P

*** | ***

***
F

*** | ***

***

Status

Outstanding

Amount

300,000,000 USD

Placement

***

Redemption (put/call option)

*** (-)

ACI

Country of risk

China

Current coupon

***%

Price

Yield / Duration

Placement amount

300,000,000 USD
Outstanding amount

300,000,000 USD
USD equivalent

300,000,000 USD
Minimum Settlement Amount

200,000 USD
ISIN RegS

XS2377688093
Common Code RegS

237768809
CFI RegS

DBFNFR
FIGI RegS

BBG0132X5MX7
Ticker

CDHIIN 2.7 10/28/26

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Issue information

Profile

Chengdu Hi-tech Investment Group Co., Ltd. develops and operates industrial parks. The company engages in development and operation of High-tech Zone South Park and West Park; project financing and management through the capital operation and financial instruments; operation and management of state-owned assets; and enterprise and technology development of Chengdu Hi-tech Zone.

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Borrower

Go to the issuer page
Chengdu Hi-tech Investment Group
Full borrower / issuer name

Chengdu Hi-tech Investment Group
Sector

Corporate
Industry

Domestic and Commercial Construction

Volume

Placement amount

300,000,000 USD
Outstanding amount

300,000,000 USD
Outstanding face value amount

300,000,000 USD

Face value

Minimum Settlement Amount

200,000 USD
Outstanding face value

*** USD
Increment

*** USD
Face value

1,000 USD

Listing

Listing

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Private investor

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Cash flow parameters

Reference rate

***

Coupon Rate

***

Day count convention

***

Interest Accrual Date

***

Coupon frequency

*** time(s) per year
Payment currency

***
Maturity date

***

Cash flow

Calculations for international bonds are made according to the minimum trading lot

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Early redemption terms

***

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100 000

stocks

175 910

ETF & Funds

100 000

indices

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Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds

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Placement

Placement method

Open subscription
Placement type

Public
Placement

***
Initial issue price (yield)

(***%)
Geographic breakdown

***
Investor breakdown

***
Use of proceeds

Refinance
Use of proceeds description

Refinance

Participants

Bookrunner

***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***
Depository

***, ***

Conversion and exchange

Conversion terms

***

Latest issues

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Similar issues

News

28/04/2026	Upcoming Issue: Chengdu Hi-tech Investment Group 1Y
28/04/2026	Upcoming Issue: Chengdu Hi-tech Investment Group 5Y
23/07/2025	Upcoming Issue: Chengdu Hi-tech Investment Group
16/08/2022	New issue: Issuer Chengdu Hi-tech Investment Group issued bonds () with the coupon rate of 3.17% in the amount of CNY 2500 mln maturing in 2032
20/10/2021	New bond issue: Chengdu Hi-tech Investment Group issued international bonds (XS2377688093) with a 2.7% coupon maturing in 2026

All organization news

IFRS/US GAAP reports

2022



	IV q eng
2021

	II q eng

	IV q eng

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Identifiers

ISIN RegS

XS2377688093
Cbonds ID

1160959
CUSIP RegS

***
CUSIP 144A

***
Common Code RegS

237768809
CFI RegS

DBFNFR
FIGI RegS

BBG0132X5MX7
WKN RegS

A3K8BW
Ticker

CDHIIN 2.7 10/28/26
Type of security by CBR

***

Ratings

Bond classification

Senior Unsecured
Registered
Coupon bonds
Non-complex financial instruments (MiFID)
Trace-eligible
Amortization
Callable
CDO
Convertible
Dual currency bonds
Variable rate
For qualified investors (CIS region)
Foreign bonds
Green bonds
Guaranteed
Inflation-linked principal
Supranational bond issues
Inflation-linked coupon
Mortgage bonds
Perpetual
Payment-in-kind
Non-Marketable Securities
Redemption Linked
Restructuring
Retail bonds
Covered
Securitization
Structured product
Commercial Bonds
Subordinated
Sukuk

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Restructuring

***