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Chengdu Hi-tech Investment Group Bonds, 3.38% 26apr2033, CNY (FIGI BBG01G9P0CR2, 2380125, CND10006CHD1)

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Domestic bonds

Issue | Issuer
Issuer
  • M
    ***  | ***
    ***
  • S&P
    ***  | ***
    ***
  • F
    ***  | ***
    ***
Status
Outstanding
Amount
600,000,000 CNY
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
China
Current coupon
***%
Price
Yield / Duration
  • Placement amount
    600,000,000 CNY
  • Outstanding amount
    600,000,000 CNY
  • USD equivalent
    89,008,093.8 USD
  • Face value
    100 CNY
  • ISIN
    CND10006CHD1
  • CFI
    DBFXFR
  • FIGI
    BBG01G9P0CR2
  • Ticker
    CDHIIN V3.38 04/26/33 INBK
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Issue information

Profile
Chengdu Hi-tech Investment Group Co., Ltd. develops and operates industrial parks. The company engages in development and operation of High-tech Zone South Park and West Park; project financing and management through the capital operation and financial ...
Chengdu Hi-tech Investment Group Co., Ltd. develops and operates industrial parks. The company engages in development and operation of High-tech Zone South Park and West Park; project financing and management through the capital operation and financial instruments; operation and management of state-owned assets; and enterprise and technology development of Chengdu Hi-tech Zone.
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  • Issuer
    Go to the issuer page
    Chengdu Hi-tech Investment Group
  • Full borrower / issuer name
    Chengdu Hi-tech Investment Group
  • Sector
    Corporate
  • Industry
    Domestic and Commercial Construction
Volume
  • Placement amount
    600,000,000 CNY
  • Outstanding amount
    600,000,000 CNY
  • Outstanding face value amount
    600,000,000 CNY
  • USD equivalent
    89,008,094 USD
Face value
  • Face value
    100 CNY
  • Outstanding face value
    *** CNY
  • Increment
    *** CNY
Listing
  • Listing

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

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Early redemption terms

***

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Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds
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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Order book
    *** - ***
  • Placement
    *** - ***
  • Initial issue price (yield)
    (***%)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

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Similar issues

News

28/04/2026 Upcoming Issue: Chengdu Hi-tech Investment Group 1Y
28/04/2026 Upcoming Issue: Chengdu Hi-tech Investment Group 5Y
23/07/2025 Upcoming Issue: Chengdu Hi-tech Investment Group
16/08/2022 New issue: Issuer Chengdu Hi-tech Investment Group issued bonds () with the coupon rate of 3.17% in the amount of CNY 2500 mln maturing in 2032
20/10/2021 New bond issue: Chengdu Hi-tech Investment Group issued international bonds (XS2377688093) with a 2.7% coupon maturing in 2026
All organization news

IFRS/US GAAP reports

2022
IV q eng
2021
II q eng
IV q eng
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Identifiers

  • State registration number
    2380125
  • ISIN
    CND10006CHD1
  • Cbonds ID
    1464782
  • CFI
    DBFXFR
  • FIGI
    BBG01G9P0CR2
  • Ticker
    CDHIIN V3.38 04/26/33 INBK
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Rank: Undefined
  • Registered
  • Coupon bonds
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Non-complex financial instruments (MiFID)
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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