Chengdu Hi-tech Investment Group Bonds, FRN perp., CNY (FIGI BBG018X3QG95, 2280322, CND10005H2N3)

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Domestic bonds, Perpetual, Variable rate

Issue | Issuer

Issuer

M

*** | ***

***
S&P

*** | ***

***
F

*** | ***

***

Status

Early redeemed

Amount

1,000,000,000 CNY

Placement

***

Early redemption

*** (-)

ACI

Country of risk

China

Current coupon

Price

Yield / Duration

Placement amount

1,000,000,000 CNY
Outstanding amount

1,000,000,000 CNY
Face value

100 CNY
ISIN

CND10005H2N3
CFI

DBVXFR
FIGI

BBG018X3QG95
Ticker

CDHIIN V3.2 PERP INBK

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Issue information

Profile

Chengdu Hi-tech Investment Group Co., Ltd. develops and operates industrial parks. The company engages in development and operation of High-tech Zone South Park and West Park; project financing and management through the capital operation and financial instruments; operation and management of state-owned assets; and enterprise and technology development of Chengdu Hi-tech Zone.

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Issuer

Go to the issuer page
Chengdu Hi-tech Investment Group
Full borrower / issuer name

Chengdu Hi-tech Investment Group
Sector

Corporate
Industry

Domestic and Commercial Construction

Volume

Placement amount

1,000,000,000 CNY
Outstanding amount

1,000,000,000 CNY

Face value

Face value

100 CNY
Outstanding face value

*** CNY
Increment

*** CNY

Listing

Listing

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Cash flow parameters

Variable rate type

Floating rate

Reference rate

1W SHIBOR

Coupon Rate

***

Day count convention

***

Interest Accrual Date

***
Coupon frequency

*** time(s) per year
Payment currency

***
Early redemption date

***

Cash flow

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Early redemption terms

***

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1 000 000

bonds

100 000

stocks

175 910

ETF & Funds

100 000

indices

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— Are you looking for the complete & verified bond data?

— We have everything you need:

Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds

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Placement

Placement method

Open subscription
Placement type

Public
Order book

*** - ***
Placement

*** - ***
Initial issue price (yield)
Geographic breakdown

***
Investor breakdown

***

Conversion and exchange

Conversion terms

***

Latest issues

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Similar issues

News

28/04/2026	Upcoming Issue: Chengdu Hi-tech Investment Group 1Y
28/04/2026	Upcoming Issue: Chengdu Hi-tech Investment Group 5Y
23/07/2025	Upcoming Issue: Chengdu Hi-tech Investment Group
16/08/2022	New issue: Issuer Chengdu Hi-tech Investment Group issued bonds () with the coupon rate of 3.17% in the amount of CNY 2500 mln maturing in 2032
20/10/2021	New bond issue: Chengdu Hi-tech Investment Group issued international bonds (XS2377688093) with a 2.7% coupon maturing in 2026

All organization news

IFRS/US GAAP reports

2022



	IV q eng
2021

	II q eng

	IV q eng

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Identifiers

State registration number

2280322
ISIN

CND10005H2N3
Cbonds ID

1317303
CUSIP

***
CUSIP 144A

***
CFI

DBVXFR
FIGI

BBG018X3QG95
Ticker

CDHIIN V3.2 PERP INBK
Type of security by CBR

***

Ratings

Bond classification

Rank: Undefined
Registered
Coupon bonds
Variable rate
Perpetual
Amortization
Callable
CDO
Convertible
Dual currency bonds
For qualified investors (CIS region)
Foreign bonds
Green bonds
Guaranteed
Inflation-linked principal
Supranational bond issues
Inflation-linked coupon
Mortgage bonds
Non-complex financial instruments (MiFID)
Payment-in-kind
Non-Marketable Securities
Redemption Linked
Restructuring
Retail bonds
Covered
Securitization
Structured product
Commercial Bonds
Subordinated
Sukuk
Trace-eligible

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Restructuring

***