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Leidos, Inc., 2.95% 15may2023, USD (FIGI RegS BBG00TQHGXJ0)

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International bonds, Senior Unsecured

Issue | Borrower
Borrower
  • M
    ***  | ***
    ***
  • S&P
    ***  | ***
    ***
  • F
    ***  | ***
    ***
Status
Early redeemed
Amount
500,000,000 USD
Placement
***
Early redemption
*** (-)
ACI
Country of risk
USA
Current coupon
-
Price
Yield / Duration
Calculate in two clicks! yield, duration and other parameters
Calculate in two clicks! yield, duration and other parameters
Calculator What is a calculator?
  • Placement amount
    500,000,000 USD
  • Minimum Settlement Amount
    2,000 USD
  • CFI RegS
    DBFNFR
  • FIGI RegS
    BBG00TQHGXJ0
  • Ticker
    LDOS 2.95 05/15/23 REGS

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Issue information

Profile
Leidos, formerly known as Science Applications International Corporation (SAIC), is an American defense, aviation, information technology, and biomedical research company headquartered in Reston, Virginia, that provides scientific, engineering, systems integration, and technical services. Leidos works extensively ...
Leidos, formerly known as Science Applications International Corporation (SAIC), is an American defense, aviation, information technology, and biomedical research company headquartered in Reston, Virginia, that provides scientific, engineering, systems integration, and technical services. Leidos works extensively with the United States Department of Defense (4th largest DoD contractor FY2012), the United States Department of Homeland Security, and the United States Intelligence Community, including the NSA, as well as other U.S. government civil agencies and selected commercial markets.
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  • Borrower
    Go to the issuer page
    Leidos, Inc.
  • Full borrower / issuer name
    Leidos, Inc.
  • Sector
    Corporate
  • Industry
    Aircraft Production and Defense
Volume
  • Placement amount
    500,000,000 USD
Face value
  • Minimum Settlement Amount
    2,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    1,000 USD

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***
  • Early redemption date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot
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Early redemption terms

***

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70 000

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
    (***%)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***, ***, ***
  • Depository
    ***, ***, ***

Conversion and exchange

Latest issues

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Similar issues

News

20/02/2026 New issues: Leidos, Inc. issued international bonds (US52532XAM74, US52532XAN57) in the amount of USD 600, USD 800 mln maturing in 2029, 2036 respectively.
14/02/2025 New issues: Leidos, Inc. issued international bonds (US52532XAK19, US52532XAL91) in the amount of USD 500, USD 500 mln maturing in 2032, 2035 respectively.
17/02/2023 New issue: Issuer Leidos, Inc. issued international bonds (US52532XAJ46) with the coupon rate of 5.75% in the amount of USD 750 mln maturing in 2033
18/05/2020 New bond issue: Leidos, Inc. issued international bonds (USU5254FAC96) with a 4.375% coupon for USD 750.0m maturing in 2030
18/05/2020 New bond issue: Leidos, Inc. issued international bonds (USU5254FAB14) with a 3.625% coupon for USD 500.0m maturing in 2025
All organization news

IFRS/US GAAP reports

2016
I q eng
II q eng
2015
I q eng
II q eng
III q eng
IV q eng
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Identifiers

  • ISIN RegS
    ***
  • Cbonds ID
    728177
  • ISIN 144A
    ***
  • CUSIP RegS
    ***
  • CUSIP 144A
    ***
  • CFI RegS
    DBFNFR
  • CFI 144A
    DBFNFR
  • FIGI RegS
    BBG00TQHGXJ0
  • FIGI 144A
    BBG00TQHGX73
  • Ticker
    LDOS 2.95 05/15/23 REGS
  • Type of security by CBR
    ***
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Ratings

Bond classification

  • Senior Unsecured
  • Registered
  • Coupon bonds
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Non-complex financial instruments (MiFID)
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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