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Organization: Leidos, Inc.
LEI 5493006I78VIN6J1BQ95

Organization name
Leidos, Inc.
Country name
USA
Country of registration
USA
Industry
Aircraft Production and Defense
Bond debt
3,411 mln USD

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Profile

Leidos, formerly known as Science Applications International Corporation (SAIC), is an American defense, aviation, information technology, and biomedical research company headquartered in Reston, Virginia, that provides scientific, engineering, systems integration, and technical services. Leidos works extensively with the United States Department of Defense (4th largest DoD contractor FY2012), the United States Department of Homeland Security, and the United States Intelligence Community, including the NSA, as well as other U.S. government civil agencies and selected commercial markets.

Awards

News

24/05/2023 S&P Global Ratings affirms Leidos, Inc. at "BBB-" (Local Currency LT credit rating); outlook stable
24/05/2023 S&P Global Ratings affirms Leidos, Inc. at "BBB-" (Foreign Currency LT credit rating); outlook stable
17/02/2023 New issue: Issuer Leidos, Inc. issued international bonds (US52532XAJ46) with the coupon rate of 5.75% in the amount of USD 750 mln maturing in 2033
16/02/2023 S&P: Leidos Inc.'s Proposed Senior Unsecured Notes Rated 'BBB-' (Rating action commentary)
16/02/2023 Moody's assigns Baa2 rating to new senior unsecured notes of Leidos, Inc. (Rating action commentary)
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Documentation

IFRS/US GAAP reports

2016
I q eng
II q eng
2015
I q eng
II q eng
III q eng
IV q eng
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Bond classification

  • Organization does not disclose IFRS/US GAAP financial statements

Bond debt by currency

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Codes

  • LEI
    5493006I78VIN6J1BQ95
  • SIC
    7373 SERVICES-COMPUTER INTEGRATED SYSTEMS DESIGN
  • CIK
    0000353394

Credit and ESG Ratings

Macroeconomic Indicators - Leidos, Inc.

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