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Xilinx, 3% 15mar2021, USD (FIGI BBG0063MC8W8, WKN A1VE19)

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International bonds, Senior Unsecured

Issue | Borrower
Borrower
  • M
    ***  | ***
    ***
  • S&P
    ***  | ***
    ***
  • F
    ***  | ***
    ***
Status
Matured
Amount
500,000,000 USD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
USA
Current coupon
-
Price
Yield / Duration
Calculate in two clicks! yield, duration and other parameters
Calculate in two clicks! yield, duration and other parameters
Calculator What is a calculator?
  • Placement amount
    500,000,000 USD
  • Minimum Settlement Amount
    2,000 USD
  • CFI
    DBFUGR
  • FIGI
    BBG0063MC8W8
  • SEDOL
    BKJL735
  • Ticker
    AMD 3 03/15/21

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Issue information

Profile
Xilinx, Inc. (Xilinx) designs, develops and markets programmable platforms. These programmable platforms have a number of components, including integrated circuits (ICs) in the form of programmable logic devices (PLDs), including Extensible Processing Platforms (EPPs); software design ...
Xilinx, Inc. (Xilinx) designs, develops and markets programmable platforms. These programmable platforms have a number of components, including integrated circuits (ICs) in the form of programmable logic devices (PLDs), including Extensible Processing Platforms (EPPs); software design tools to program the PLDs; targeted reference designs; printed circuit boards, and intellectual property (IP), which consists of Xilinx and various third-party verification and IP cores. In addition to its programmable platforms, Xilinx provides design services, customer training, field engineering and technical support. The Company’s PLDs include field programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs) that its customers program to perform logic functions, and EPPs. Xilinx’s products are offered to electronic equipment manufacturers. In January 2011, the Company acquired AutoESL Design Technologies, Inc.
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  • Borrower
    Go to the issuer page
    Xilinx
  • Full borrower / issuer name
    Xilinx
  • Sector
    Corporate
  • Industry
    Semiconductors
  • Stocks
    Xilinx, ordinary share
Volume
  • Placement amount
    500,000,000 USD
Face value
  • Minimum Settlement Amount
    2,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    1,000 USD

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot
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Early redemption terms

***

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    *** - ***
  • Initial issue price (yield)
    (***%)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

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Similar issues

News

27/01/2022 Xilinx: Other Events
26/01/2022 Xilinx Reports Record Revenue of $1.01 Billion in Fiscal Third Quarter
27/10/2021 Xilinx Reports Record Revenue in Fiscal Second Quarter 2022
28/07/2021 Xilinx Reports Fiscal First Quarter 2022 Results
13/05/2020 New bond issue: Xilinx issued international bonds (US983919AK78) with a 2.375% coupon for USD 750.0m maturing in 2030
All organization news

IFRS/US GAAP reports

2021
I q eng
II q eng
III q eng
IV q eng
2020
I q eng
II q eng
III q eng
IV q eng
2019
I q eng
II q eng
III q eng
IV q eng
2018
I q eng
II q eng
III q eng
IV q eng
2017
I q eng
II q eng
III q eng
IV q eng
2016
I q eng
II q eng
III q eng
IV q eng
2015
I q eng
II q eng
III q eng
IV q eng
2014
IV q eng
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Identifiers

  • ISIN
    ***
  • Cbonds ID
    68275
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • CFI
    DBFUGR
  • FIGI
    BBG0063MC8W8
  • WKN
    A1VE19
  • SEDOL
    BKJL735
  • Ticker
    AMD 3 03/15/21
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Registered
  • Coupon bonds
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Non-complex financial instruments (MiFID)
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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