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Organization: Xilinx
LEI 6EY4K7ZMF9UX1CU6KC79

Organization name
Xilinx Inc
Country name
USA
Country of registration
USA
Industry
Semiconductors
Bond debt
1,500 mln USD

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Profile

Xilinx, Inc. (Xilinx) designs, develops and markets programmable platforms. These programmable platforms have a number of components, including integrated circuits (ICs) in the form of programmable logic devices (PLDs), including Extensible Processing Platforms (EPPs); software design tools to program the PLDs; targeted reference designs; printed circuit boards, and intellectual property (IP), which consists of Xilinx and various third-party verification and IP cores. In addition to its programmable platforms, Xilinx provides design services, customer training, field engineering and technical support. The Company’s PLDs include field programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs) that its customers program to perform logic functions, and EPPs. Xilinx’s products are offered to electronic equipment manufacturers. In January 2011, the Company acquired AutoESL Design Technologies, Inc.

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Bond classification

  • Organization does not disclose IFRS/US GAAP financial statements

Bond debt by currency

Codes

  • LEI
    6EY4K7ZMF9UX1CU6KC79
  • SIC
    3674 SEMICONDUCTORS & RELATED DEVICES
  • ICB
    9,500 Technology
  • CIK
    0000743988

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