Hint mode is switched on Switch off
For swift navigation between sections

Xilinx
LEI 6EY4K7ZMF9UX1CU6KC79

Organization name
Xilinx Inc
Country name
USA
Country of registration
USA
Industry
Semiconductors
Credit Ratings
in foreign currency
  • M/S&P/F
    *** / *** / ***
Public debt
750 mln USD

Upgrade to Premium features

Cbonds consolidates global bond, stock, ETF and indices data into a single platform — so you can analyze faster, make informed investment decisions and outperform the market

Get access
Welcome to Cbonds
  • Full access to the largest bond database

    Bond parameters,
    prospectuses

  • Seamless
    Data export

    Analyze the data in the most efficient way

  • Bond pricing

    Current & historical quotes from 400+ stock exchanges & OTC market

  • Smart risk assessment

    Credit ratings, financial reports

Latest data on

Get access to the largest financial database

Try in 7-days Demo access

Free for company representative

  • Evaluate advanced analytical tools
  • Get full online access to the database
  • Try our powerful bond screener
  • Track bond prices from 400+ sources

Quotes

Request sent
Access denied
Quotes provided by information providers are indicative in nature

Profile

Xilinx, Inc. (Xilinx) designs, develops and markets programmable platforms. These programmable platforms have a number of components, including integrated circuits (ICs) in the form of programmable logic devices (PLDs), including Extensible Processing Platforms (EPPs); software design tools to program the PLDs; targeted reference designs; printed circuit boards, and intellectual property (IP), which consists of Xilinx and various third-party verification and IP cores. In addition to its programmable platforms, Xilinx provides design services, customer training, field engineering and technical support. The Company’s PLDs include field programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs) that its customers program to perform logic functions, and EPPs. Xilinx’s products are offered to electronic equipment manufacturers. In January 2011, the Company acquired AutoESL Design Technologies, Inc.

Awards

Documentation

Stocks

Latest issues

Public debt by currencies

Codes

  • LEI
    6EY4K7ZMF9UX1CU6KC79
  • SIC
    3674 SEMICONDUCTORS & RELATED DEVICES
  • ICB
    9,500 Technology
  • NACE
    *** ***
  • NAICS
    *** ***
  • CIK
    0000743988
  • EIN
    77-0188631
Registration is required to get access.