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Domestic bonds: Advanced Semiconductor Engineering, 1.45% 13jan2024, TWD
B67520, TW000B675206

  • Placement amount
    4,300,000,000 TWD
  • Outstanding amount
    4,300,000,000 TWD
  • USD equivalent
    154,954,954.95 USD
  • Denomination
    1,000,000 TWD
  • ISIN
    TW000B675206
  • CFI
    DBFUFR
  • FIGI
    BBG00FPGGH35
  • Ticker
    ADSEMI 1.45 01/13/24 051B

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Issue information

Profile
Advanced Semiconductor Engineering Inc. (ASE Inc.), founded in 1984, is a member of the ASE Group. It is one of the world’s leading providers of semiconductor manufacturing services and a leader in offering a comprehensive range ...
Advanced Semiconductor Engineering Inc. (ASE Inc.), founded in 1984, is a member of the ASE Group. It is one of the world’s leading providers of semiconductor manufacturing services and a leader in offering a comprehensive range of advanced IC packaging.
ASE Kaohsiung, the flagship company in ASE Group, possesses valuable expertise in product and process technology for the manufacturing of CSP, high frequency packages, MCM, flip chip and wafer bumping manufacturing.
The ASE Group is a global leader specialized in total backend solutions for the semiconductor industry. It offers turnkey services for integrated test, packaging, system assembly and product delivery.
Volume
  • Placement amount
    4,300,000,000 TWD
  • Outstanding amount
    4,300,000,000 TWD
  • Outstanding face value amount
    4,300,000,000 TWD
  • USD equivalent
    154,954,955 USD
Nominal
  • Nominal
    1,000,000 TWD
  • Outstanding face value
    *** TWD
  • Integral multiple
    *** TWD

Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count fraction
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Delay days
    *** days
  • Maturity date
    ***
  • Early redemption date
    ***

Early redemption terms

***

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Order book
    *** (***) - *** (***)
  • Coupon (Yield) Guidance
    ***% - ***% (*** - ***%)
  • Placement
    *** - ***
  • Initial issue price (yield)
    (***%)
  • Bids
    *** TWD
  • Number of bids
    ***
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
  • Listing
    ***

Conversion and exchange

  • Convertion date
    ***
  • Initial premium
    ***%
  • Convertible until
    ***
  • Lock-up
    *** days
  • Conversion terms
    ***

Additional information

***

Latest issues

Identifiers

  • State registration number
    B67520
  • Registration
    ***
  • Date of program registration
    ***
  • ISIN
    TW000B675206
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • CFI
    DBFUFR
  • FIGI
    BBG00FPGGH35
  • WKN
    A28ST9
  • Ticker
    ADSEMI 1.45 01/13/24 051B
  • Type of security by CBR
    ***

Ratings



Bond classification

  • Registered
  • Coupon bonds
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Floating rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Indexed
  • Supranational bond issues
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Subordinated
  • Sukuk
  • Trace-eligible

Restructuring

***

***