Bond Screener
Advanced Semiconductor Engineering
LEI 254900W5BZM5ILCPWL43
Organization name
Advanced Semiconductor Engineering Inc. (ASE Inc.)
Country name
Taiwan
Country of registration
Taiwan
Industry
Miscellaneous Machinery and Industrial Equipment
Credit Ratings
in foreign currency
Public debt
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Profile
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Advanced Semiconductor Engineering Inc. (ASE Inc.), founded in 1984, is a member of the ASE Group. It is one of the world’s leading providers of semiconductor manufacturing services and a leader in offering a comprehensive range of advanced IC packaging.
ASE Kaohsiung, the flagship company in ASE Group, possesses valuable expertise in product and process technology for the manufacturing of CSP, high frequency packages, MCM, flip chip and wafer bumping manufacturing. The ASE Group is a global leader specialized in total backend solutions for the semiconductor industry. It offers turnkey services for integrated test, packaging, system assembly and product delivery. |
General information
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Organization nameAdvanced Semiconductor Engineering Inc. (ASE Inc.)
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Organization statusOperating organization
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Address333 Keelung Rd. Section 1, 19F Taipei, Taiwan, 11012
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Site
News
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New bond issue: Advanced Semiconductor Engineering sells USD 200.0m in 2018 bonds with a 0% coupon26/06/2015
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New bond issue: Advanced Semiconductor Engineering sells USD 400m in 2018 bonds05/09/2013
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ASE chips in to dim sum supply surge13/09/2011
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New bond issue: Advanced Semiconductor Engineering sells CNY 150m in 2014 bonds with 3.125% coupon13/09/2011
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New bond issue: Advanced Semiconductor Engineering sells CNY 500m in 2016 bonds with 4.250% coupon13/09/2011
Stocks
General information
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Organization nameAdvanced Semiconductor Engineering Inc. (ASE Inc.)
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Organization statusOperating organization
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Address333 Keelung Rd. Section 1, 19F Taipei, Taiwan, 11012
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Site
Codes
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LEI254900W5BZM5ILCPWL43
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ICB9,500 Technology
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NACE*** ***
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NAICS*** ***
