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Summit Digitel Infrastructure Bonds, 7.505% 30jun2031, INR (FIGI BBG023WQ7NQ2, INE507T07211)

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Domestic bonds, Variable rate, Senior Secured

Issue | Issuer
Issuer
  • M
    ***  | ***
    ***
  • S&P
    ***  | ***
    ***
  • F
    ***  | ***
    ***
Status
Outstanding
Amount
12,000,000,000 INR
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
India
Current coupon
-
Price
Yield / Duration
  • Placement amount
    12,000,000,000 INR
  • Outstanding amount
    12,000,000,000 INR
  • USD equivalent
    125,561,363.93 USD
  • Face value
    100,000 INR
  • ISIN
    INE507T07211
  • FIGI
    BBG023WQ7NQ2
  • Ticker
    SUMDIG 7.505 06/30/31

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Issue information

Profile
Summit Digitel Infrastructure Limited was incorporated in 2013 and is based in Mumbai, India. It was formerly known as Reliance Jio Infratel Private Limited and Summit Digitel Infrastructure Private Limited. The company operates and manages telecom ...
Summit Digitel Infrastructure Limited was incorporated in 2013 and is based in Mumbai, India. It was formerly known as Reliance Jio Infratel Private Limited and Summit Digitel Infrastructure Private Limited. The company operates and manages telecom tower assets transferred from Reliance Jio Infocomm Limited. It operates as a special purpose vehicle.
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  • Issuer
    Go to the issuer page
    Summit Digitel Infrastructure
  • Full borrower / issuer name
    Summit Digitel Infrastructure
  • Sector
    Corporate
  • Industry
    Communication Services
Volume
  • Placement amount
    12,000,000,000 INR
  • Outstanding amount
    12,000,000,000 INR
  • Outstanding face value amount
    12,000,000,000 INR
  • USD equivalent
    125,561,364 USD
Face value
  • Face value
    100,000 INR
  • Outstanding face value
    *** INR
  • Increment
    *** INR
Listing
  • Listing

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Cash flow parameters

  • Variable rate type
    Rate change under special conditions
  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Early redemption terms

***

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1 000 000

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full data on over 1 000 000 bonds, 100 000 stocks, 100 000 indices, 17 000 ETF and 150 000 Mutual Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

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Why

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Placement

  • Placement method
    Closed subscription
  • Placement type
    Private
  • Order book
    *** - ***
  • Placement
    ***
  • Initial issue price (yield)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
  • Use of proceeds description
    To refinance, repay, or prepay existing borrowings of the Issuer, with proceeds strictly limited to bank finance eligible end uses and in compliance with Reserve Bank of India regulations, and SEBI regulations.

Conversion and exchange

  • Conversion terms
    ***

Latest issues

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Similar issues

News

05/08/2021 New bond issue: Summit Digitel Infrastructure issued international bonds (USY8190DAA55) with a 2.875% coupon maturing in 2031
02/08/2021 Upcoming issue: Summit Digitel Infrastructure
All organization news

Identifiers

  • ISIN
    INE507T07211
  • Cbonds ID
    2308001
  • FIGI
    BBG023WQ7NQ2
  • Ticker
    SUMDIG 7.505 06/30/31
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Secured
  • Coupon bonds
  • Variable rate
  • Non-complex financial instruments (MiFID)
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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