New bond issue: Summit Digitel Infrastructure issued international bonds (USY8190DAA55) with a 2.875% coupon maturing in 2031
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Statusoutstanding
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Country of riskIndia
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Redemption (put/call option)
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Amount500,000,000 USD
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М/S&P/F
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Full nameSummit Digitel Infrastructure Limited
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Registration countryIndia
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IndustryCommunication Services
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М/S&P/F
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