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Winbond Electronics, 0% 31mar2027, USD (Conv.) (FIGI BBG0217B64K6, XS3322329080)

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International bonds, Convertible, Zero-coupon bonds, Senior Unsecured

Status
Outstanding
Amount
750,000,000 USD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
Taiwan
Current coupon
***%
Price
Yield / Duration
Calculate in two clicks! yield, duration and other parameters
Calculate in two clicks! yield, duration and other parameters
Calculator What is a calculator?
  • Placement amount
    750,000,000 USD
  • Outstanding amount
    750,000,000 USD
  • USD equivalent
    750,000,000 USD
  • Minimum Settlement Amount
    200,000 USD
  • ISIN
    XS3322329080
  • Common Code
    332232908
  • CFI
    DCZNFR
  • FIGI
    BBG0217B64K6
  • Ticker
    WINBON 0 03/31/27

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Issue information

Profile
Winbond Electronics Corporation produces semiconductors and several types of integrated circuits, including Code Storage Flash Memory, specialty DRAM and mobile DRAM, microcontrollers, and personal computer ICs. Winbond Electronics Corporation was established in 1987 and is headquartered ...
Winbond Electronics Corporation produces semiconductors and several types of integrated circuits, including Code Storage Flash Memory, specialty DRAM and mobile DRAM, microcontrollers, and personal computer ICs. Winbond Electronics Corporation was established in 1987 and is headquartered in Taichung City, Taiwan.
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Volume
  • Placement amount
    750,000,000 USD
  • Outstanding amount
    750,000,000 USD
  • Outstanding face value amount
    750,000,000 USD
Face value
  • Minimum Settlement Amount
    200,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    100,000 USD
Listing
  • Listing

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Representative of the company 7 days FREE trial

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Private investor

Individual access

Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot
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Early redemption terms

***

Explore the most comprehensive database

1 000 000

bonds

80 234

stocks

167 970

ETF & Funds

70 000

indices

Track your portfolio in the most efficient way

  • Bond Search
  • Watchlist
  • Excel ADD-IN
Get access
×

— Are you looking for the complete & verified bond data?

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full data on over 900 000 bonds, 80 000 stocks, 116 000 ETF & Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

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Why

You will have detailed descriptive & pricing data for 650K bonds, 76K stocks, 8K ETFs
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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
  • Use of proceeds
    General Corporate Purposes
  • Use of proceeds description
    General Corporate Purposes
Participants
  • Bookrunner
    ***, ***
  • Depository
    ***, ***
  • Trustee
    ***

Conversion and exchange

  • Initial premium
    ***%
  • Convertible until
    ***
  • Conversion terms
    ***

Latest issues

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Similar issues

News

26/03/2026 New issue: Winbond Electronics issued international bonds (XS3322329080) in the amount of USD 750 mln maturing in 2027
19/02/2025 Winbond Electronics Board Decides Against Dividend Distribution
All organization news

IFRS/US GAAP reports

2025
I q eng
II q eng
III q eng
IV q eng
2024
I q eng
II q eng
III q eng
IV q eng
2023
I q eng
II q eng
III q eng
IV q eng
2022
I q eng
II q eng
III q eng
IV q eng
2021
I q eng
II q eng
III q eng
IV q eng
2020
IV q eng
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Identifiers

  • ISIN
    XS3322329080
  • Cbonds ID
    2113665
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • Common Code
    332232908
  • CFI
    DCZNFR
  • FIGI
    BBG0217B64K6
  • Ticker
    WINBON 0 03/31/27
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Zero-coupon bonds
  • Senior Unsecured
  • Registered
  • Convertible
  • Amortization
  • Callable
  • CDO
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Non-complex financial instruments (MiFID)
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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