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Winbond Electronics
LEI 254900STBMBTLA91J410

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Organization name
Winbond Electronics Corporation
Country name
Taiwan
Country of registration
Taiwan
Industry
Semiconductors
Public debt
750 mln USD
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Profile

Winbond Electronics Corporation produces semiconductors and several types of integrated circuits, including Code Storage Flash Memory, specialty DRAM and mobile DRAM, microcontrollers, and personal computer ICs. Winbond Electronics Corporation was established in 1987 and is headquartered in Taichung City, Taiwan.

Awards

News

26/03/2026 New issue: Winbond Electronics issued international bonds (XS3322329080) in the amount of USD 750 mln maturing in 2027
19/02/2025 Winbond Electronics Board Decides Against Dividend Distribution
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Documentation

IFRS/US GAAP reports

2026
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2025
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2024
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2023
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2022
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2021
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2020
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Codes

  • LEI
    254900STBMBTLA91J410
  • SIC
    3672 PRINTED CIRCUIT BOARDS
  • NACE
    *** ***
  • NAICS
    *** ***
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