×
For more information, get in touch with our team:
+44 7918 53 08 73
Hint mode is switched on Switch off
For swift navigation between sections

Domestic bonds: Advanced Semiconductor Engineering, 3.125% 22sep2014, CNY
HK0000088994

DATA PLATFORM FOR FINANCIAL MARKET PROFESSIONALS AND INVESTORS
  • High performance interface for global bond market screening
  • Full information on close to 500,000 bonds from 180 countries
  • 100% coverage of Eurobonds worldwide
  • Over 300 primary sources of prices
  • Ratings data from all international and local ratings agencies
  • Stock market data from 100 world trading floors
  • Intuitive, high speed user interface
  • Data access via the website, mobile application and add-in for Microsoft Excel

Trading chart

Stock exchange selection
Stock exchange selection
More about Cbonds Estimation
Bond is not traded; the issue is redeemed
Data display in a chart | table
Data display in a chart | table
Work with the chart: switching the price, period, issue comparison
Work with the chart: switching the price, period, issue comparison
Download the chart in a convenient format
Customize fields in the table
Found: {{ graphTablePointsTotal }}
Show all fields
* Data is not available within the selected subscription
Latest data on

Issue information

Profile
Advanced Semiconductor Engineering Inc. (ASE Inc.), founded in 1984, is a member of the ASE Group. It is one of the world’s leading providers of semiconductor manufacturing services and a leader in offering a comprehensive range ...
Advanced Semiconductor Engineering Inc. (ASE Inc.), founded in 1984, is a member of the ASE Group. It is one of the world’s leading providers of semiconductor manufacturing services and a leader in offering a comprehensive range of advanced IC packaging.
ASE Kaohsiung, the flagship company in ASE Group, possesses valuable expertise in product and process technology for the manufacturing of CSP, high frequency packages, MCM, flip chip and wafer bumping manufacturing.
The ASE Group is a global leader specialized in total backend solutions for the semiconductor industry. It offers turnkey services for integrated test, packaging, system assembly and product delivery.
Volume
  • Placement amount
    150,000,000 CNY
  • Outstanding amount
    150,000,000 CNY
Nominal
  • Nominal
    1,000,000 CNY
  • Outstanding face value
    *** CNY
  • Par amount, integral multiple
    *** CNY

Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count fraction
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Delay days
    *** days
  • Maturity date
    ***
  • Early redemption date
    ***

Cash flow

Early redemption terms

***

DATA PLATFORM FOR FINANCIAL MARKET PROFESSIONALS AND INVESTORS
  • High performance interface for global bond market screening
  • Full information on close to 500,000 bonds from 180 countries
  • 100% coverage of Eurobonds worldwide
  • Over 300 primary sources of prices
  • Ratings data from all international and local ratings agencies
  • Stock market data from 100 world trading floors
  • Intuitive, high speed user interface
  • Data access via the website, mobile application and add-in for Microsoft Excel

Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Order book
    *** (***) - *** (***)
  • Coupon (Yield) Guidance
    ***% - ***% (*** - ***%)
  • Placement
    *** - ***
  • Initial issue price (yield)
    (***%)
  • Bids
    *** CNY
  • Number of bids
    ***
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
  • Listing
    ***
Participants
  • Bookrunner
    ***

Conversion and exchange

  • Convertion date
    ***
  • Initial premium
    ***%
  • Convertible until
    ***
  • Lock-up
    *** days
  • Conversion terms
    ***

Additional information

***

Latest issues

Identifiers

  • Registration
    ***
  • Date of program registration
    ***
  • ISIN RegS
    HK0000088994
  • CUSIP RegS
    ***
  • CUSIP 144A
    ***
  • Common Code RegS
    067739833
  • CFI RegS
    DBFUFR
  • FIGI RegS
    BBG0022D0H79
  • Ticker
    ADSEMI 3.125 09/22/14 REGS
  • Type of security by CBR
    ***

Ratings



Bond classification

  • Registered
  • Coupon bonds
  • Foreign bonds
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Floating rate
  • For qualified investors (CIS region)
  • Green bonds
  • Indexed
  • Supranational bond issues
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Subordinated
  • Sukuk
  • Trace-eligible

Restructuring

***

***