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Domestic bonds: Advanced Semiconductor Engineering, 3.125% 22sep2014, CNY
HK0000088994

  • Placement amount
    150,000,000 CNY
  • Outstanding amount
    150,000,000 CNY
  • Denomination
    1,000,000 CNY
  • ISIN RegS
    HK0000088994
  • Common Code RegS
    067739833
  • CFI RegS
    DBFUFR
  • FIGI RegS
    BBG0022D0H79
  • Ticker
    ADSEMI 3.125 09/22/14 REGS

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Issue information

Profile
Advanced Semiconductor Engineering Inc. (ASE Inc.), founded in 1984, is a member of the ASE Group. It is one of the world’s leading providers of semiconductor manufacturing services and a leader in offering a comprehensive range ...
Advanced Semiconductor Engineering Inc. (ASE Inc.), founded in 1984, is a member of the ASE Group. It is one of the world’s leading providers of semiconductor manufacturing services and a leader in offering a comprehensive range of advanced IC packaging.
ASE Kaohsiung, the flagship company in ASE Group, possesses valuable expertise in product and process technology for the manufacturing of CSP, high frequency packages, MCM, flip chip and wafer bumping manufacturing.
The ASE Group is a global leader specialized in total backend solutions for the semiconductor industry. It offers turnkey services for integrated test, packaging, system assembly and product delivery.
Volume
  • Placement amount
    150,000,000 CNY
  • Outstanding amount
    150,000,000 CNY
Nominal
  • Nominal
    1,000,000 CNY
  • Outstanding face value
    *** CNY
  • Integral multiple
    *** CNY

Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count fraction
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Early redemption terms

***

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Identifiers

  • ISIN RegS
    HK0000088994
  • CUSIP RegS
    ***
  • CUSIP 144A
    ***
  • Common Code RegS
    067739833
  • CFI RegS
    DBFUFR
  • FIGI RegS
    BBG0022D0H79
  • Ticker
    ADSEMI 3.125 09/22/14 REGS
  • Type of security by CBR
    ***

Bond classification

  • Registered
  • Coupon bonds
  • Foreign bonds
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible

Restructuring

***

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