CLP Power Bonds, 4.095% 19may2028, USD (74) (FIGI BBG01V2M7Z04, HK0001150868)

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Domestic bonds, Senior Unsecured

Issue | Issuer

Issuer

M

*** | ***

***
S&P

*** | ***

***
F

*** | ***

***

Status

Outstanding

Amount

100,000,000 USD

Placement

***

Redemption (put/call option)

*** (-)

ACI

Country of risk

Hong Kong

Current coupon

***%

Price

Yield / Duration

Placement amount

100,000,000 USD
Outstanding amount

100,000,000 USD
USD equivalent

100,000,000 USD
Face value

1,000 USD
ISIN

HK0001150868
Common Code

307961300
CFI

DTFXFX
FIGI

BBG01V2M7Z04
Ticker

CHINLP 4.095 05/19/28 EMTN

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Issue information

Profile

CLP Power Hong Kong Limited (CLP Power) is the principal subsidiary of CLP Holdings, and is the largest electricity company in Hong Kong. First established in 1901 as the China Light and Power Limited, we operate a vertically integrated electricity generation, transmission and distribution business. Today we serve 2.2 million customers in commercial, infrastructure and public sector as well as the domestic customers - representing 80% of Hong Kong's population - in a 1,000 square kilometre area encompassing Kowloon, the New Territories and most outlying islands. With this extensive and diversified customer base we play a vital role in fuelling the growth and prosperity of Hong Kong society

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Issuer

Go to the issuer page
CLP Power
Full borrower / issuer name

CLP Power
Sector

Corporate
Industry

Power
SPV / Issuer

CLP Power Hong Kong Financing Limited

Volume

Placement amount

100,000,000 USD
Outstanding amount

100,000,000 USD
Outstanding face value amount

100,000,000 USD

Face value

Face value

1,000 USD
Outstanding face value

*** USD
Increment

*** USD

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Cash flow parameters

Reference rate

***

Coupon Rate

***

Day count convention

***

Interest Accrual Date

***

Coupon frequency

*** time(s) per year
Payment currency

***
Maturity date

***

Cash flow

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Early redemption terms

***

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bonds

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175 910

ETF & Funds

100 000

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Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds

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Placement

Placement method

Open subscription
Placement type

Public
Placement

***
Geographic breakdown

***
Investor breakdown

***

Participants

Bookrunner

***

Conversion and exchange

Conversion terms

***

Latest issues

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Similar issues

News

09/03/2026	Upcoming Issue: CLP Power
10/01/2025	New issue: CLP Power issued international bonds (XS2964354570) in the amount of USD 500 mln
14/07/2021	New bond issue: CLP Power issued international bonds (XS2364591367) with a 2.25% coupon maturing in 2031
23/06/2020	New bond issue: CLP Power issued international bonds (XS2193950354) with a 2.125% coupon for USD 750.0m maturing in 2030
23/06/2020	New bond issue: CLP Power issued international bonds (XS2193950271) with a 2.5% coupon for USD 250.0m maturing in 2035

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Related entities on 08/04/2022

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Identifiers

ISIN

HK0001150868
Cbonds ID

1862563
Common Code

307961300
CFI

DTFXFX
FIGI

BBG01V2M7Z04
Ticker

CHINLP 4.095 05/19/28 EMTN
Type of security by CBR

***

Ratings

Bond classification

Senior Unsecured
Coupon bonds
Non-complex financial instruments (MiFID)
Amortization
Callable
CDO
Convertible
Dual currency bonds
Variable rate
For qualified investors (CIS region)
Foreign bonds
Green bonds
Guaranteed
Inflation-linked principal
Supranational bond issues
Inflation-linked coupon
Mortgage bonds
Perpetual
Payment-in-kind
Non-Marketable Securities
Redemption Linked
Restructuring
Retail bonds
Covered
Securitization
Structured product
Commercial Bonds
Subordinated
Sukuk
Trace-eligible

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Restructuring

***