New bond issue: CLP Power issued international bonds (XS2193950271) with a 2.5% coupon for USD 250.0m maturing in 2035
| Show full article |
|
This functionality is available for registred users only
|
-
Statusoutstanding
-
Country of riskHong Kong
-
Redemption (put/call option)
*** -
Amount250,000,000 USD
-
М/S&P/F
*** /*** /***
-
Full nameCLP Power Hong Kong Limited
-
Registration countryHong Kong
-
IndustryPower
-
М/S&P/F
*** /*** /***









