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Advanced Semiconductor Engineering, 0% 27mar2018, USD (Conv.) (FIGI BBG009HSHR57, XS1243895189, WKN A1Z3QS)

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International bonds, Convertible, Zero-coupon bonds, Senior Unsecured

Issue | Borrower
Borrower
  • M
    ***  | ***
    ***
  • S&P
    ***  | ***
    ***
  • F
    ***  | ***
    ***
Status
Matured
Amount
200,000,000 USD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
Taiwan
Current coupon
-
Price
Yield / Duration
Calculate in two clicks! yield, duration and other parameters
Calculate in two clicks! yield, duration and other parameters
Calculator What is a calculator?
  • Placement amount
    200,000,000 USD
  • Outstanding amount
    200,000,000 USD
  • Minimum Settlement Amount
    200,000 USD
  • ISIN
    XS1243895189
  • Common Code
    124389518
  • CFI
    DCZNCR
  • FIGI
    BBG009HSHR57
  • Ticker
    ADSEMI 0 03/27/18

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Issue information

Profile
Advanced Semiconductor Engineering Inc. (ASE Inc.), founded in 1984, is a member of the ASE Group. It is one of the world’s leading providers of semiconductor manufacturing services and a leader in offering a comprehensive range ...
Advanced Semiconductor Engineering Inc. (ASE Inc.), founded in 1984, is a member of the ASE Group. It is one of the world’s leading providers of semiconductor manufacturing services and a leader in offering a comprehensive range of advanced IC packaging.
ASE Kaohsiung, the flagship company in ASE Group, possesses valuable expertise in product and process technology for the manufacturing of CSP, high frequency packages, MCM, flip chip and wafer bumping manufacturing.
The ASE Group is a global leader specialized in total backend solutions for the semiconductor industry. It offers turnkey services for integrated test, packaging, system assembly and product delivery.
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  • Borrower
    Go to the issuer page
    Advanced Semiconductor Engineering
  • Full borrower / issuer name
    Advanced Semiconductor Engineering
  • Sector
    Corporate
  • Industry
    Miscellaneous Machinery and Industrial Equipment
Volume
  • Placement amount
    200,000,000 USD
  • Outstanding amount
    200,000,000 USD
Face value
  • Minimum Settlement Amount
    200,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    200,000 USD
Listing
  • Listing

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot
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Early redemption terms

***

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***, ***, ***, ***, ***
  • Arranger Legal Adviser (International law)
    ***
  • Issuer Legal Adviser (Domestic law)
    ***

Conversion and exchange

  • Initial premium
    ***%
  • Convertible until
    ***
  • Conversion terms
    ***

Covenants

  • Change of Control

    ***

  • Collective Action Clause

    ***

  • Covenant Suspension/Fall-Away

    ***

  • Cross Default

    ***

  • Designation of Restricted and Unrestricted Subsidiaries

    ***

  • Events of Default

    ***

  • Financial Covenants

    ***

  • Limitation on Business Activities

    ***

  • Limitation on Dividend and Other Payment Restrictions Affecting Restricted Subsidiaries

    ***

  • Limitation on Indebtedness

    ***

  • Limitation on Investments

    ***

  • Limitation on Liens

    ***

  • Limitation on Restricted Payments

    ***

  • Limitation on Sale of Assets

    ***

  • Limitation on Sale/Leaseback

    ***

  • Limitation on Subsidiary Debt

    ***

  • Limitation on layering (anti-layering)

    ***

  • Limitations on transactions with affiliates

    ***

  • Merger Restrictions

    ***

  • Rating Trigger

    ***

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Latest issues

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Similar issues

News

26/06/2015 New bond issue: Advanced Semiconductor Engineering sells USD 200.0m in 2018 bonds with a 0% coupon
05/09/2013 New bond issue: Advanced Semiconductor Engineering sells USD 400m in 2018 bonds
13/09/2011 ASE chips in to dim sum supply surge
13/09/2011 New bond issue: Advanced Semiconductor Engineering sells CNY 150m in 2014 bonds with 3.125% coupon
13/09/2011 New bond issue: Advanced Semiconductor Engineering sells CNY 500m in 2016 bonds with 4.250% coupon
All organization news

Identifiers

  • ISIN
    XS1243895189
  • Cbonds ID
    152643
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • Common Code
    124389518
  • CFI
    DCZNCR
  • FIGI
    BBG009HSHR57
  • WKN
    A1Z3QS
  • Ticker
    ADSEMI 0 03/27/18
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Zero-coupon bonds
  • Senior Unsecured
  • Registered
  • Convertible
  • Amortization
  • Callable
  • CDO
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Non-complex financial instruments (MiFID)
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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