New bond issue: Lai Fung Holdings Limited issued international bonds (XS1747539465) with a 5.65% coupon for USD 350.0m maturing in 2023
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Statusredeemed
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Country of riskHong Kong
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Redemption (put/call option)
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Amount346,500,000 USD
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М/S&P/F
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Full nameLai Fung Holdings Limited
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Registration countryCayman Islands
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IndustryDomestic and Commercial Construction
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М/S&P/F
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