New bond issue: Lai Sun will issue international bonds with a 4.6% coupon for USD 400.0m maturing in 2022
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Statusredeemed
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Country of riskHong Kong
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Redemption (put/call option)
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Amount400,000,000 USD
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М/S&P/F
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Full nameLai Sun Development Company Limited
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Registration countryHong Kong
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IndustryMiscellaneous Construction
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М/S&P/F
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