New issues: QUALCOMM issued international bonds (US747525CB72, US747525BZ59) in the amount of USD 750, USD 750 mln maturing in 2033, 2036 respectively.
| Show full article |
|
This functionality is available for registred users only
|
-
Statusoutstanding
-
Country of riskUSA
-
Redemption (put/call option)20/11/2033 (
*** ) -
Amount750,000,000 USD
-
М/S&P/F
*** /*** /***
-
Full nameQUALCOMM Incorporated
-
Registration countryUSA
-
IndustryTelecommunication Equipment
-
М/S&P/F
*** /*** /***










