New issues: Issuer QUALCOMM released international bonds (US747525AS26, US747525AR43, US747525AT09, US747525AU71, US747525AV54) in the amount of USD 500, USD 946, USD 914, USD 2000, USD 1500 mln maturing in 2023, 2023, 2024, 2027, 2047 respectively.
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Statusredeemed
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Country of riskUSA
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Redemption (put/call option)
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Amount500,000,000 USD
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М/S&P/F
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Full nameQUALCOMM Incorporated
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Registration countryUSA
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IndustryTelecommunication Equipment
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М/S&P/F
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