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New bond issue: Telefonica Moviles Chile issued international bonds (USP90375AV12) with a 3.537% coupon maturing in 2031

November 12, 2021 Cbonds
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Issue — Telefonica Moviles Chile, 3.537% 18nov2031, USD
  • Status
    outstanding
  • Country of risk
    Chile
  • Redemption (put/call option)
    *** (***)
  • Amount
    500,000,000 USD
  • М/S&P/F
    — / — / —
Company — Telefonica Moviles Chile
  • Full name
    Telefonica Moviles Chile S.A.
  • Registration country
    Chile
  • Industry
    Communication Services

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