New bond issue: Autodesk issued international bonds (US052769AH94) with a 2.4% coupon maturing in 2031
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Statusoutstanding
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Country of riskUSA
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Redemption (put/call option)
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Amount1,000,000,000 USD
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М/S&P/F
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Full nameAutodesk Inc
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Registration countryUSA
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IndustryIT Services and Computer Programming
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М/S&P/F
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