New bond issue: T-Mobile USA issued bonds (US87264ABU88) with a 2.625% coupon for USD 1,200.0m maturing in 2026
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Statusredeemed
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Country of riskUSA
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Redemption (put/call option)
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Amount1,200,000,000 USD
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М/S&P/F
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Full nameT-Mobile USA, Inc.
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Registration countryUSA
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IndustryCommunication Services
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М/S&P/F
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