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Upcoming issue: Taiwan Semiconductor Manufacturing Co Ltd

February 9, 2021 Cbonds
Issuer: Taiwan Semiconductor Manufacturing Co Ltd (TSMC) 

Issue description: domestic unsecured corporate bonds 

Date: near future

Volume: not to exceed T$120 billion

Aim: to fund expansion and spend around $178 mln to open a Japanese material research subsidiary

Last month the company reported its best quarterly profit and increased revenue and capital spending estimates to record levels. 

Additional issue:

Issuer: TSMC Global (wholly-owned subsidiary)

Issue description: USD-denominated senior unsecured corporate bonds 

Date: near future

Volume: not to exceed $4.5 billion

Aim: to finance TSMC’s capacity expansion and/or pollution prevention-related expenditures
Company — TSMC
  • Full name
    Taiwan Semiconductor Manufacturing Company, Limited
  • Registration country
    Taiwan
  • Industry
    Information and High Technologies