New bond issue: Bank of China (Hong Kong) issued international bonds (XS2280441721) with a 2.8% coupon for CNY 1,800.0m maturing in 2023
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Statusredeemed
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Country of riskHong Kong
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Redemption (put/call option)
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Amount1,800,000,000 CNY
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М/S&P/F
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Full nameBank of China (Hong Kong) Limited
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Registration countryHong Kong
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IndustryBanks
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М/S&P/F
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