New bond issue: Win-Semiconductors issued international bonds (XS2275382286) with a 0% coupon for USD 500.0m maturing in 2026
| Show full article |
|
This functionality is available for registred users only
|
-
Statusredeemed
-
Country of riskTaiwan
-
Redemption (put/call option)
*** -
Amount288,400,000 USD
-
М/S&P/F
*** /*** /***
-
Full nameWin Semiconductors Corp
-
Registration countryTaiwan
-
IndustrySemiconductors
-
М/S&P/F
*** /*** /***









