New bond issue: Roper Technologies issued international bonds (US776743AN67) with a 1.4% coupon for USD 700.0m maturing in 2027
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Statusoutstanding
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Country of riskUSA
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Redemption (put/call option)
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Amount700,000,000 USD
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М/S&P/F
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Full nameRoper Technologies, Inc
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Registration countryUSA
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IndustryIT Services and Computer Programming
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М/S&P/F
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