New bond issue: American Honda Finance issued bonds (US02665WDL28) with a 1.2% coupon for USD 750.0m maturing in 2025

July 06, 2020 American Honda Finance issued bonds (US02665WDL28) with a 1.2% coupon for USD 750.0m maturing in 2025. Bonds were sold at a price of 99.976% with an initial yield of 1.205%. Bookrunner: BNP Paribas, JP Morgan, Mizuho Financial Group, Wells Fargo. Depository: Clearstream Banking S.A., DTCC, Euroclear Bank..

• Status
  outstanding
• Country of risk
  USA
• Redemption (put/call option)
  *** (***)
• Amount
  750,000,000 USD
• М/S&P/F
  — / — / —

• Full name
  American Honda Finance Corporation
• Registration country
  USA
• Industry
  Financial institutions