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New bond issue: Hysan Development issued international bonds (XS2178221490) with a 2.875% coupon for USD 400.0m maturing in 2027

May 28, 2020
May 26, 2020 Hysan Development issued international bonds (XS2178221490) with a 2.875% for USD 400.0m maturing in 2027. Bonds were sold at a price of 99.31%. Bookrunner: Bank of America Merrill Lynch, HSBC, JP Morgan, Mizuho Financial Group, UBS.
Issue — Hysan Development, 2.875% 2jun2027, USD
  • Status
    outstanding
  • Country of risk
    Hong Kong
  • Redemption (put/call option)
    *** (***)
  • Amount
    400,000,000 USD
  • М/S&P/F
    — / — / —
Company — Hysan Development
  • Full name
    Hysan Development Company Ltd
  • Registration country
    Hong Kong
  • Industry
    Financial institutions

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