New bond issue: Applied Materials issued international bonds (US038222AN54) with a 1.75% coupon for USD 750.0m maturing in 2030
May 27, 2020
May 26, 2020 Applied Materials issued international bonds (US038222AN54) with a 1.75% for USD 750.0m maturing in 2030. Bonds were sold at a price of 99.617%. Bookrunner: Bank of America Merrill Lynch, Goldman Sachs, JP Morgan, Citigroup, Mizuho Financial Group, Mitsubishi UFJ Financial Group, Wells Fargo, U.S. Bancorp. Depository: Clearstream Banking S.A., DTCC, Euroclear Bank. |
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Statusoutstanding
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Country of riskUSA
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Redemption (put/call option)
*** (*** ) -
Amount750,000,000 USD
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М/S&P/F— / — / —
Company — Applied Materials

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Full nameApplied Materials Inc
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Registration countryUSA
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IndustryEngineering industry
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