New bond issue: Singapore Technologies Engineering issued international bonds (XS2163022739) with a 1.5% coupon for USD 750.0m maturing in 2025
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Statusredeemed
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Country of riskSingapore
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Redemption (put/call option)
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Amount750,000,000 USD
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М/S&P/F
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Full nameSingapore Technologies Engineering Ltd
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Registration countrySingapore
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IndustryAircraft Production and Defense
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М/S&P/F
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