New bond issue: Hewlett Packard Enterprise issued international bonds (US42824CBG33) with a 4.5% coupon for USD 1,250.0m maturing in 2023
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Statusredeemed
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Country of riskUSA
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Redemption (put/call option)
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Amount1,250,000,000 USD
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М/S&P/F
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Full nameHewlett Packard Enterprise Co.
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Registration countryUSA
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IndustryIT equipment
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М/S&P/F
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