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New bond issue: Tower Bersama Infrastructure issued international bonds (XS2099045515) with a 4.25% coupon for USD 350.0m maturing in 2025

January 14, 2020
January 13, 2020 Tower Bersama Infrastructure issued international bonds (XS2099045515) with a 4.25% for USD 350.0m maturing in 2025. Bonds were sold at a price of 100%.
Issue — Tower Bersama Infrastructure, 4.25% 21jan2025, USD
  • Status
    outstanding
  • Country of risk
    Indonesia
  • Redemption (put/call option)
    *** (***)
  • Amount
    350,000,000 USD
  • М/S&P/F
    — / — / —
Company — Tower Bersama Infrastructure
  • Full name
    Tower Bersama Infrastructure TBK (P.T.)
  • Registration country
    Indonesia
  • Industry
    Communication

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