New bond issue: WuXi AppTec issued international bonds (XS2045749798) with a 0% coupon for USD 300.0m maturing in 2024
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Statusearly redeemed
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Country of riskChina
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Redemption (put/call option)
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Amount300,000,000 USD
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М/S&P/F
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Full nameWuXi AppTec Co., Ltd.
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Registration countryChina
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IndustryPharmaceutical Preparation and Biotechnology
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М/S&P/F
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