New bond issue: Amkor Technology issued international bonds (USU03169AM81) with a 6.625% coupon for USD 525.0m maturing in 2027
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Statusearly redeemed
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Country of riskUSA
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Redemption (put/call option)
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Amount525,000,000 USD
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М/S&P/F
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Full nameAmkor Technology, Inc.
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Registration countryUSA
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IndustrySemiconductors
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М/S&P/F
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