New bond issue: Ryder System issued bonds (US78355HKL23) with a 3.65% coupon for USD 600.0m maturing in 2024
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Statusredeemed
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Country of riskUSA
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Redemption (put/call option)
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Amount600,000,000 USD
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М/S&P/F
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Full nameRyder System, Inc.
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Registration countryUSA
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IndustryTransportation Support Activities
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М/S&P/F
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