Hint mode is switched on Switch off
For swift navigation between sections

Chip Eng Seng Corporation (CES)
LEI 2549005EKK86CG8L6E59

Organization name
Chip Eng Seng Corporation LTD
Country name
Singapore
Country of registration
Singapore
Industry
Miscellaneous Construction
Public debt
-

Upgrade to Premium features

Cbonds consolidates global bond, stock, ETF and indices data into a single platform — so you can analyze faster, make informed investment decisions and outperform the market

Get access
Welcome to Cbonds
  • Full access to the largest bond database

    Bond parameters,
    prospectuses

  • Seamless
    Data export

    Analyze the data in the most efficient way

  • Bond pricing

    Current & historical quotes from 400+ stock exchanges & OTC market

  • Smart risk assessment

    Credit ratings, financial reports

Latest data on

Get access to the largest financial database

Try in 7-days Demo access

Free for company representative

  • Evaluate advanced analytical tools
  • Get full online access to the database
  • Try our powerful bond screener
  • Track bond prices from 400+ sources

Quotes

Request sent
Access denied
Quotes provided by information providers are indicative in nature

Profile

Chip Eng Seng Corporation Ltd (CES) is a construction and property group listed on the mainboard of the Singapore Exchange Securities Trading Limited.

Awards

Documentation

Stocks

Latest issues

Public debt by currencies

Codes

  • LEI
    2549005EKK86CG8L6E59
  • SIC
    1522 Residential construction
  • UEN
    199805196H
Registration is required to get access.