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Zhen Ding Technology
LEI 549300H7R4K33675UP38

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Organization name
Zhen Ding Technology Holding Ltd
Country name
Taiwan
Country of registration
Cayman Islands
Industry
Semiconductors
Public debt
400 mln USD
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Profile

Zhen Ding Technology Holding Limited (ZDT) was established in June, 2006, and is specialized in manufacturing Flexible Printed Circuit (FPC), High Density Interconnection (HDI), Rigid Printed Circuit Board (R-PCB) and Integrated Circuit Substrate (ICS). These products are broadly applied in the area of computer information, consumer electronics, communication, and networking products.

Awards

News

22/09/2025 New issue: Zhen Ding Technology issued international bonds (XS3170882131) in the amount of USD 400 mln maturing in 2030
16/07/2024 Zhen Ding Technology's Board OKs Merger of Two Units
19/01/2024 New issue: Issuer Zhen Ding Technology issued international bonds (XS2742707644) in the amount of USD 400 mln maturing in 2029
25/06/2020 New bond issue: Zhen Ding Technology issued international bonds (XS2195093674) with a 0% coupon for USD 400.0m maturing in 2025
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Documentation

IFRS/US GAAP reports

2025
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2024
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2023
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2022
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2021
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2020
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2019
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2018
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Codes

  • LEI
    549300H7R4K33675UP38
  • SIC
    3577 COMPUTER PERIPHERAL EQUIPMENT, NEC
  • NACE
    *** ***
  • NAICS
    *** ***
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