Highlands Holdings Bond Issuer
LEI 894500QEH89ZMUFQMM46
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General information
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Organization nameHighlands Holdings Bond Issuer, Ltd.
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Organization statusOperating organization
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AddressPark Place, 55 Par la Ville Road, Hamilton, Bermuda
News
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New bond issue: Highlands Holdings Bond Issuer issued international bonds (XS2406913884) with a 0% coupon maturing in 202309/11/2021
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New bond issue: Highlands Holdings Bond Issuer issued international bonds (XS2406915236) with a 0.934% coupon maturing in 203109/11/2021
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New bond issue: Highlands Holdings Bond Issuer issued international bonds (XS2406914346) with a 0.318% coupon maturing in 202609/11/2021
IFRS/US GAAP reports
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