Hint mode is switched on Switch off
For swift navigation between sections

Kinsus Interconnect Technology

PDF download

Choose all Reset all
Download Cancel
Organization name
Kinsus Interconnect Technology Corp.
Country name
Taiwan
Country of registration
-
Industry
Semiconductors
Public debt
-
Welcome to Cbonds
New to Cbonds? · Take a 90-second tour of the platform.

Discover what you can do with Cbonds

Everything you need for fixed income research and monitoring.

  • 00:23 Coverage
  • 00:40 Bond screener
  • 00:54 Parameters
  • 01:10 Watchlist, Mobile app
  • 01:15 Excel Add-in
Get access Watch full tour

Latest data on

Get access to the largest financial database

Try in 7-days Demo access

Free for company representative

  • Evaluate advanced analytical tools
  • Get full online access to the database
  • Try our powerful bond screener
  • Track bond prices from 400+ sources

Get access to the largest financial database

Representative of the company 7 days FREE trial

Professional access to the data

Private investor

Individual access

Quotes

Request sent
Access denied
Send request
Quotes provided by information providers are indicative in nature

Profile

Kinsus Interconnect Technology Corp. manufactures BGA (Ball Grid Array) boards. The Company's products include PBGA (Plastic BGA), MCM (Multi Chip Module) BGA, Mini BGA, TEBGA (Thermal Enhanced BGA), and flip chip substrate boards.

Awards

Documentation

Stocks

Public debt by currencies

Show more Hide

Codes

  • SIC
    3577 COMPUTER PERIPHERAL EQUIPMENT, NEC
  • NACE
    *** ***
  • NAICS
    *** ***
Registration is required to get access.