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Resideo Funding
LEI 5493000IFJ6XJKH66598

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Liquidated
Successor company: Resideo Funding II
Organization name
Resideo Funding Inc.
Country name
USA
Country of registration
USA
Industry
Other Sectors
Credit Ratings
in foreign currency
  • M/S&P/F
    *** / *** / ***
Public debt
-
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Profile

Resideo Funding Inc. is a financing subsidiary established to issue debt and support the financing activities of Resideo Technologies, Inc.

Awards

News

12/07/2024 New issue: Resideo Funding issued international bonds (USU76107AC27) with the coupon rate of 6.5% in the amount of USD 600 mln maturing in 2032
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Codes

  • LEI
    5493000IFJ6XJKH66598
  • NACE
    *** ***
  • NAICS
    *** ***
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