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TSMC, 2.25% 23apr2031, USD (FIGI RegS BBG01064RTY3, WKN A3KP5V)

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International bonds, Guaranteed, Trace-eligible, Senior Unsecured

Issue | Borrower
Borrower
  • M
    ***   | ***
    ***
  • S&P
    ***   | ***
    ***
  • F
    ***   | ***
    ***
Status
Outstanding
Amount
1,500,000,000 USD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
Taiwan
Current coupon
***%
Price
Yield / Duration
Reports of guarantors / borrowers / offerers
Guarantor TSMC
Reporting IFRS
  • Placement amount
    1,500,000,000 USD
  • Outstanding amount
    1,500,000,000 USD
  • USD equivalent
    1,500,000,000 USD
  • Minimum Settlement Amount
    200,000 USD
  • CFI RegS
    DBFUGR
  • FIGI RegS
    BBG01064RTY3
  • SEDOL
    BNSPYP0
  • Ticker
    TAISEM 2.25 04/23/31 REGS
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Issue information

Profile
Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore" wafer production processes ...
Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore" wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment's leading technologies and TSMC COMPATIBLE design services. TSMC has consistently experienced strong growth by building solid partnerships with its customers, large and small. IC suppliers from around the world trust TSMC with their manufacturing needs, thanks to its unique integration of cutting-edge process technologies, pioneering design services, manufacturing productivity and product quality.
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Volume
  • Placement amount
    1,500,000,000 USD
  • Outstanding amount
    1,500,000,000 USD
  • Outstanding face value amount
    1,500,000,000 USD
Face value
  • Minimum Settlement Amount
    200,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    1,000 USD
Listing
  • Listing

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Business Day Convention
    Following Business Day
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot
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Early redemption terms

***

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Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds
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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
    (***%)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
  • Use of proceeds
    General Corporate Purposes
  • Use of proceeds description
    General Corporate Purposes
Participants
  • Bookrunner
    ***, ***, ***, ***
  • Depository
    ***, ***, ***
  • Arranger Legal Adviser (International law)
    ***
  • Issuer Legal Adviser (Domestic law)
    ***
  • Issuer Legal Adviser (International law)
    ***

Conversion and exchange

  • Conversion terms
    ***

Covenants

  • Change of Control

    ***

  • Collective Action Clause

    ***

  • Covenant Suspension/Fall-Away

    ***

  • Cross Default

    ***

  • Designation of Restricted and Unrestricted Subsidiaries

    ***

  • Events of Default

    ***

  • Financial Covenants

    ***

  • Limitation on Business Activities

    ***

  • Limitation on Dividend and Other Payment Restrictions Affecting Restricted Subsidiaries

    ***

  • Limitation on Indebtedness

    ***

  • Limitation on Investments

    ***

  • Limitation on Liens

    ***

  • Limitation on Restricted Payments

    ***

  • Limitation on Sale of Assets

    ***

  • Limitation on Sale/Leaseback

    ***

  • Limitation on Subsidiary Debt

    ***

  • Limitation on layering (anti-layering)

    ***

  • Limitations on transactions with affiliates

    ***

  • Merger Restrictions

    ***

  • Others

    ***

  • Rating Trigger

    ***

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Issue is included in calculation of indices

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News

03/08/2026 New issue: TSMC issued bonds (TW000B618ED2) with the coupon rate of 2.03% in the amount of TWD 14000 mln maturing in 2031
17/07/2026 TSMC Outlook Boosted by AI Growth, Analyst Raises Target
16/07/2026 Taiwan Semiconductor Manufacturing Company (NYSE: TSM): Strong AI-Driven Earnings Amidst Valuation Scrutiny
16/07/2026 Taiwan Semiconductor Manufacturing Company (NYSE:TSM) Earnings Preview: A Crucial Test for the AI Sector
06/07/2026 TSMC: A Critical Player in the AI Semiconductor Market (NYSE: TSM)
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IFRS/US GAAP reports

2025
IV q eng
2024
IV q eng
2023
IV q eng
2022
IV q eng
2021
IV q eng
2020
IV q eng
2019
IV q eng
2018
IV q eng
2017
IV q eng
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Identifiers

  • ISIN RegS
    ***
  • Cbonds ID
    994229
  • ISIN 144A
    ***
  • CUSIP RegS
    ***
  • CUSIP 144A
    ***
  • CFI RegS
    DBFUGR
  • CFI 144A
    DBFUGR
  • FIGI RegS
    BBG01064RTY3
  • FIGI 144A
    BBG01064RV69
  • WKN RegS
    A3KP5V
  • SEDOL
    BNSPYP0
  • Ticker
    TAISEM 2.25 04/23/31 REGS
  • Type of security by CBR
    ***
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Ratings

Bond classification

  • Senior Unsecured
  • Registered
  • Coupon bonds
  • Guaranteed
  • Trace-eligible
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Non-complex financial instruments (MiFID)
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
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Restructuring

***

Holders

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