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International bonds: TSMC, 2.25% 23apr2031, USD
USG91139AH14

  • Placement amount
    1,500,000,000 USD
  • Outstanding amount
    1,500,000,000 USD
  • USD equivalent
    1,500,000,000 USD
  • Minimum Settlement Amount
    200,000 USD
  • ISIN RegS
    USG91139AH14
  • CFI RegS
    DBFUGR
  • FIGI RegS
    BBG01064RTY3
  • SEDOL
    BNSPYP0
  • Ticker
    TAISEM 2.25 04/23/31 REGS

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Issue information

Profile
Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore" wafer production processes ...
Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore" wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment's leading technologies and TSMC COMPATIBLE design services. TSMC has consistently experienced strong growth by building solid partnerships with its customers, large and small. IC suppliers from around the world trust TSMC with their manufacturing needs, thanks to its unique integration of cutting-edge process technologies, pioneering design services, manufacturing productivity and product quality.
Volume
  • Placement amount
    1,500,000,000 USD
  • Outstanding amount
    1,500,000,000 USD
  • Outstanding face value amount
    1,500,000,000 USD
Nominal
  • Minimum Settlement Amount
    200,000 USD
  • Outstanding face value
    *** USD
  • Integral multiple
    *** USD
  • Nominal
    1,000 USD

Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count fraction
    ***
  • Business Day Convention
    Following Business Day
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Delay days
    *** days
  • Maturity date
    ***
  • Early redemption date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot

Early redemption terms

***

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Order book
    *** (***) - *** (***)
  • Coupon (Yield) Guidance
    ***% - ***% (*** - ***%)
  • Issuer rating on issue date (M/S&P/F)
    *** / *** / -
  • Placement
    *** - ***
  • Initial issue price (yield)
    (***%)
  • Bids
    *** USD
  • Number of bids
    ***
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
  • The purpose of placing
    General Corporate Purposes
  • Listing
    ***
Participants
  • Bookrunner
    ***, ***, ***, ***
  • Depository
    ***, ***, ***
  • Arranger Legal Adviser (International law)
    ***
  • Issuer Legal Adviser (Domestic law)
    ***
  • Issuer Legal Adviser (International law)
    ***

Conversion and exchange

  • Convertion date
    ***
  • Initial premium
    ***%
  • Convertible until
    ***
  • Lock-up
    *** days
  • Conversion terms
    ***

Additional information

***

Latest issues

Identifiers

  • Registration
    ***
  • Date of program registration
    ***
  • ISIN RegS
    ***
  • ISIN 144A
    ***
  • CUSIP RegS
    ***
  • CUSIP 144A
    ***
  • CFI RegS
    DBFUGR
  • CFI 144A
    DBFUGR
  • FIGI RegS
    BBG01064RTY3
  • FIGI 144A
    BBG01064RV69
  • WKN RegS
    A3KP5V
  • SEDOL
    BNSPYP0
  • Ticker
    TAISEM 2.25 04/23/31 REGS
  • Type of security by CBR
    ***

Ratings



Bond classification

  • Senior Unsecured
  • Registered
  • Non-documentary bonds
  • Coupon bonds
  • Trace-eligible
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Floating rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Indexed
  • Supranational bond issues
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Subordinated
  • Sukuk

Restructuring

***

***

IFRS/US GAAP reports

2020
2019
2018
2017

Holders