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Domestic bonds: TSMC, 0.5% 30mar2026, TWD (A)
B618C9, TW000B618C97

  • Placement amount
    4,800,000,000 TWD
  • Outstanding amount
    4,800,000,000 TWD
  • USD equivalent
    173,185,163.8 USD
  • Denomination
    10,000,000 TWD
  • ISIN
    TW000B618C97
  • CFI
    DBFUFR
  • FIGI
    BBG00ZRZXVW5
  • Ticker
    TAISEM 0.5 03/30/26 101A

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Issue information

Profile
Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore" wafer production processes ...
Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore" wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment's leading technologies and TSMC COMPATIBLE design services. TSMC has consistently experienced strong growth by building solid partnerships with its customers, large and small. IC suppliers from around the world trust TSMC with their manufacturing needs, thanks to its unique integration of cutting-edge process technologies, pioneering design services, manufacturing productivity and product quality.
Volume
  • Placement amount
    4,800,000,000 TWD
  • Outstanding amount
    4,800,000,000 TWD
  • Outstanding face value amount
    4,800,000,000 TWD
  • USD equivalent
    173,185,164 USD
Nominal
  • Nominal
    10,000,000 TWD
  • Outstanding face value
    *** TWD
  • Integral multiple
    *** TWD

Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count fraction
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Delay days
    *** days
  • Maturity date
    ***
  • Early redemption date
    ***

Early redemption terms

***

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Order book
    *** (***) - *** (***)
  • Coupon (Yield) Guidance
    ***% - ***% (*** - ***%)
  • Issuer rating on issue date (M/S&P/F)
    *** / *** / -
  • Placement
    *** - ***
  • Initial issue price (yield)
    (***%)
  • Bids
    *** TWD
  • Number of bids
    ***
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
  • Listing
    ***
Participants
  • Bookrunner
    ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***

Conversion and exchange

  • Convertion date
    ***
  • Initial premium
    ***%
  • Convertible until
    ***
  • Lock-up
    *** days
  • Conversion terms
    ***

Additional information

***

Latest issues

Identifiers

  • State registration number
    B618C9
  • Registration
    ***
  • Date of program registration
    ***
  • ISIN
    TW000B618C97
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • CFI
    DBFUFR
  • FIGI
    BBG00ZRZXVW5
  • Ticker
    TAISEM 0.5 03/30/26 101A
  • Type of security by CBR
    ***

Ratings



Bond classification

  • Registered
  • Coupon bonds
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Floating rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Indexed
  • Supranational bond issues
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Subordinated
  • Sukuk
  • Trace-eligible

Restructuring

***

***

IFRS/US GAAP reports

2020
2019
2018
2017