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Altera, 2.5% 15nov2018, USD (FIGI BBG005HHJS82, WKN A1HS09)

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International bonds

Status
Matured
Amount
600,000,000 USD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
USA
Current coupon
-
Price
Yield / Duration
Calculate in two clicks! yield, duration and other parameters
Calculate in two clicks! yield, duration and other parameters
Calculator What is a calculator?
  • Placement amount
    600,000,000 USD
  • Minimum Settlement Amount
    2,000 USD
  • CFI
    DBFUGR
  • FIGI
    BBG005HHJS82
  • SEDOL
    BYV76B0
  • Ticker
    INTC 2.5 11/15/18

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Bond is not traded; the issue is redeemed
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Issue information

Profile
Altera Corporation is a global semiconductor company. The Company designs, manufactures, and markets high-density programmable logic devices (PLDs), HardCopy ASIC devices, pre-defined design building blocks known as intellectual property (IP) cores, and associated development tools. Its ...
Altera Corporation is a global semiconductor company. The Company designs, manufactures, and markets high-density programmable logic devices (PLDs), HardCopy ASIC devices, pre-defined design building blocks known as intellectual property (IP) cores, and associated development tools. Its PLDs, which consist of field-programmable gate arrays (FPGAs), and complex programmable logic devices (CPLDs), are semiconductor integrated circuits that are manufactured as standard chips that its customers program to perform desired logic functions within their electronic systems. With its HardCopy devices the Company offers its customers a migration path from a PLD to a non-programmable implementation of their designs. Its customers can license IP cores from the Company for implementation of standard functions in their PLD designs.
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  • Borrower
    Go to the issuer page
    Altera
  • Full borrower / issuer name
    Altera
  • Sector
    Corporate
  • Industry
    Semiconductors
Volume
  • Placement amount
    600,000,000 USD
Face value
  • Minimum Settlement Amount
    2,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    1,000 USD

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot
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Early redemption terms

***

Explore the most comprehensive database

1 000 000

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80 234

stocks

167 970

ETF & Funds

70 000

indices

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Why

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
    (***%)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***, ***, ***, ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

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Similar issues

IFRS/US GAAP reports

2015
I q eng
II q eng
III q eng
2014
IV q eng
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Identifiers

  • ISIN
    ***
  • Cbonds ID
    85337
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • CFI
    DBFUGR
  • FIGI
    BBG005HHJS82
  • WKN
    A1HS09
  • SEDOL
    BYV76B0
  • Ticker
    INTC 2.5 11/15/18
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Rank: Undefined
  • Registered
  • Coupon bonds
  • Non-complex financial instruments (MiFID)
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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