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TSMC Bonds, 2.7% 22sep2060, USD (FIGI BBG00XDH2BB6, F16801, TW000F168018)

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Domestic bonds, Senior Unsecured

Issue | Issuer
Issuer
  • M
    ***  | ***
    ***
  • S&P
    ***  | ***
    ***
  • F
    ***  | ***
    ***
Status
Outstanding
Amount
1,000,000,000 USD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
Taiwan
Current coupon
***%
Price
Yield / Duration
  • Placement amount
    1,000,000,000 USD
  • Outstanding amount
    1,000,000,000 USD
  • USD equivalent
    1,000,000,000 USD
  • Face value
    1,000,000 USD
  • ISIN
    TW000F168018
  • CFI
    DBFUGR
  • FIGI
    BBG00XDH2BB6
  • Ticker
    TAISEM 2.7 09/22/60 09-1

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Issue information

Profile
Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore" wafer production processes ...
Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore" wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment's leading technologies and TSMC COMPATIBLE design services. TSMC has consistently experienced strong growth by building solid partnerships with its customers, large and small. IC suppliers from around the world trust TSMC with their manufacturing needs, thanks to its unique integration of cutting-edge process technologies, pioneering design services, manufacturing productivity and product quality.
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Volume
  • Placement amount
    1,000,000,000 USD
  • Outstanding amount
    1,000,000,000 USD
  • Outstanding face value amount
    1,000,000,000 USD
Face value
  • Face value
    1,000,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
Listing
  • Listing

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

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Early redemption terms

***

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***, ***

Conversion and exchange

  • Conversion terms
    ***

Issue is included in calculation of indices

Cbonds Asia Corporate IG USD Duration Index
Cbonds Asia Corporate IG USD G-spread Index
Cbonds Asia Corporate IG USD Index
Cbonds Asia Corporate IG USD Price Index
Cbonds Asia Corporate IG USD T-spread Index
Cbonds Asia Corporate IG USD YTM Index
Cbonds Asia Corporate USD Duration Index
Cbonds Asia Corporate USD G-spread Index
Cbonds Asia Corporate USD Index
Cbonds Asia Corporate USD Price Index
Cbonds Asia Corporate USD T-spread Index
Cbonds Asia Corporate USD YTM Index
Cbonds EM Corporate IG USD Duration Index
Cbonds EM Corporate IG USD G-spread Index
Cbonds EM Corporate IG USD Index
Cbonds EM Corporate IG USD Price Index
Cbonds EM Corporate IG USD T-spread Index
Cbonds EM Corporate IG USD YTM Index
Cbonds EM Corporate USD Duration Index
Cbonds EM Corporate USD G-spread Index
Cbonds EM Corporate USD Index
Cbonds EM Corporate USD Price Index
Cbonds EM Corporate USD T-spread Index
Cbonds EM Corporate USD YTM Index
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News

03/08/2026 New issue: TSMC issued bonds (TW000B618ED2) with the coupon rate of 2.03% in the amount of TWD 14000 mln maturing in 2031
17/07/2026 TSMC Outlook Boosted by AI Growth, Analyst Raises Target
16/07/2026 Taiwan Semiconductor Manufacturing Company (NYSE: TSM): Strong AI-Driven Earnings Amidst Valuation Scrutiny
16/07/2026 Taiwan Semiconductor Manufacturing Company (NYSE:TSM) Earnings Preview: A Crucial Test for the AI Sector
06/07/2026 TSMC: A Critical Player in the AI Semiconductor Market (NYSE: TSM)
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IFRS/US GAAP reports

2025
IV q eng
2024
IV q eng
2023
IV q eng
2022
IV q eng
2021
IV q eng
2020
IV q eng
2019
IV q eng
2018
IV q eng
2017
IV q eng
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Identifiers

  • State registration number
    F16801
  • ISIN
    TW000F168018
  • Cbonds ID
    830657
  • CFI
    DBFUGR
  • FIGI
    BBG00XDH2BB6
  • Ticker
    TAISEM 2.7 09/22/60 09-1
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Registered
  • Coupon bonds
  • Non-complex financial instruments (MiFID)
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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